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Browse Prior Art Database

Indium Bismuth Alloy Electroplating Solutions

IP.com Disclosure Number: IPCOM000094032D
Original Publication Date: 1966-May-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR [+2]

Abstract

These solutions are for electrodepositing low melting point alloys composed of indium and bismuth.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 81% of the total text.

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Indium Bismuth Alloy Electroplating Solutions

These solutions are for electrodepositing low melting point alloys composed of indium and bismuth.

Coatings of low temperature solder are very useful in the production and repair of heat sensitive electrical and electronic components and assemblies. In certain instances, it is desirable to electroplate coatings of low melting point alloys where the coatings must be thin and uniform in thickness as, for example, in the production of computer memory units. The coatings must be of low melting point metal to permit the attachment of electrical terminals without damaging the normally heat sensitive base.

The following formulations can be utilized to electrodeposit low melting point alloys of indium and bismuth. 1. In(2)O(3) (indium oxide) 2 grams BiCl(3) (bismuth chloridel 1 gram EDTA (ethylene diamine tetra acetic acid) 4 grams Citric acid 8 grams Hydrochloric acid (37%) 20 ml Water to make 100 ml 2. Indium sulfamate
2.5 grams BiCl(3) (bismuth trichloridel 1 gram Sodium sulfamate
7.5 grams Sodium chloride 2.5 grams Hydrochloric acid (37%) 10 ml Water to make 100 ml 3. InCl(3) (indium chloridel
3.5 grams HCl (Hydrochloric acidl 20 ml Bi(2)O(3) (bismuth oxidel 2 grams Perchloric acid (60%) 5 ml Water to make 100 ml.

Nominal operating conditions for the above listed electrolyte formulations are as follows:
Current density 40 amps/square foot Temperature 130 degrees F Anode to Cathode Ratio 2-1 pH .1 t.5 (increased with sodium...