Browse Prior Art Database

Protective Coating

IP.com Disclosure Number: IPCOM000094033D
Original Publication Date: 1966-May-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Konosky, JT: AUTHOR

Abstract

This process relates to the use of a coating of hard material, in particular a polyimide resin, as a protective coating on the bottom side of modules.

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Protective Coating

This process relates to the use of a coating of hard material, in particular a polyimide resin, as a protective coating on the bottom side of modules.

The use of this coating prevents the problem of bottom land 2 damage on double-sided modules. This problem of land cracking is caused by stresses resulting from the forces exerted upon pins 3 which are fastened to substrate 4 through such land. By applying a hard polyimide coating, such as Pyre ML*, over the lands and surrounding the pins connected to them, the stress is transferred from the lands to the pin itself and also forces the lands upon the substrate in a direction to oppose any remaining destructive stress. Another advantage of such a coating is that it prevents leaching of the bottom pattern due to the 63-37 solder.

This protective coating is compatible with resistors and can be applied in a liquid form and then cured to form a rigid protective coating. * Trademark of E.I. du Pont de Nemours and Co.

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