Browse Prior Art Database

Metalization of Polyimides

IP.com Disclosure Number: IPCOM000094035D
Original Publication Date: 1966-May-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Silver, MD: AUTHOR [+2]

Abstract

The adherence of plated metals to polyimides can be improved by the addition of finely divided colloidal silica to the liquid polyimide with a subsequent base etch.

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Metalization of Polyimides

The adherence of plated metals to polyimides can be improved by the addition of finely divided colloidal silica to the liquid polyimide with a subsequent base etch.

When .5%-20% of a finely divided colloidal silica is added to a liquid polyimide, a large proportion of the silica settles out near the surface when the polyimide is cured. This effect results in the polyimide sheet having a rough surface. The polyimide is then sensitized with an etching base solution to further prepare the surface to accept a metal plate. A 10-25% sodium hydroxide solution applied for five minutes is suitable.

The etching action of the base removes the low molecular weight polymer chains. The latter, in the ultimate product, produce a weak boundary layer between the metal plate and the underlying polyimide. An adhesive failure between the metal and polyimide results. Electroless plating techniques can be used to subsequently apply the metal coat to the preprepared polyimide surface. The prepreparation of the polyimide surface results in increased bond strengths between deposited conductive metals and supporting polyimides.

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