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Semiconductor Wafer Handling Apparatus for Chemical Etching Operations

IP.com Disclosure Number: IPCOM000094108D
Original Publication Date: 1966-May-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Hallas, CE: AUTHOR

Abstract

This apparatus holds and rotates many semiconductor wafers during chemical etching. Wafers, preferably 1 1/4 inches in diameter, can be cleaned free of dirt and etched to a roughness of less than 2.0 microinches. Specifically, lapped wafers 1 are set in a series on edge between two grooved spools 2 and 3 and guide arm 4. This has corresponding grooves 4a to hold wafers 1 in spaced relationship. Spools 2 and 3 can then be rotated to impart a corresponding rotation to wafers 1. The apparatus is then transferred through wafer cleaning, etching, quenching and drying operations.

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Semiconductor Wafer Handling Apparatus for Chemical Etching Operations

This apparatus holds and rotates many semiconductor wafers during chemical etching. Wafers, preferably 1 1/4 inches in diameter, can be cleaned free of dirt and etched to a roughness of less than 2.0 microinches. Specifically, lapped wafers 1 are set in a series on edge between two grooved spools 2 and 3 and guide arm 4. This has corresponding grooves 4a to hold wafers 1 in spaced relationship. Spools 2 and 3 can then be rotated to impart a corresponding rotation to wafers 1. The apparatus is then transferred through wafer cleaning, etching, quenching and drying operations.

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