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Improving Photoresist Adhesion to Hydrophilic Surfaces

IP.com Disclosure Number: IPCOM000094124D
Original Publication Date: 1966-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schwartz, GG: AUTHOR

Abstract

Photoresist layers are used in the fabrication of various semiconductor devices to perform localized etching of openings in, for example, silicon dioxide or phosphosilicate glass layers. Excessive undercutting during the etching step is experienced, when the surface to which the photoresist layer is applied, is hydrophilic in character. Negative photoresists, which are long chain hydrocarbons containing the functional groups which characterize each resist can have their adhesion to hydrophilic surfaces greatly increased. This is effected by making the surfaces hydrophobic.

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Improving Photoresist Adhesion to Hydrophilic Surfaces

Photoresist layers are used in the fabrication of various semiconductor devices to perform localized etching of openings in, for example, silicon dioxide or phosphosilicate glass layers. Excessive undercutting during the etching step is experienced, when the surface to which the photoresist layer is applied, is hydrophilic in character. Negative photoresists, which are long chain hydrocarbons containing the functional groups which characterize each resist can have their adhesion to hydrophilic surfaces greatly increased. This is effected by making the surfaces hydrophobic. This can be accomplished by coating the hydrophilic surface, such as silicon dioxide, with a dilute solution of a silane, such as dimethyl, dichlorosilane, drying the coating, heating the coating for a few minutes at a moderate temperature to remove any volatile compounds and finally baking the surface in an oven at an elevated temperature above about 200 degrees C. Oxidative degradation is to be avoided. The resulting surface has a thin coating of a silicone polymer which is strongly attached to the silicon dioxide surface with the nonpolar methyl groups outward.

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