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Polyimide Copper Laminates

IP.com Disclosure Number: IPCOM000094125D
Original Publication Date: 1966-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Schiller, J: AUTHOR [+2]

Abstract

This technique increases the lamination strength between copper sheets and polyimide supports which depends upon the level of precure of the copper-polyimide structure.

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Polyimide Copper Laminates

This technique increases the lamination strength between copper sheets and polyimide supports which depends upon the level of precure of the copper- polyimide structure.

A sheet of copper, e.g., 1 oz., is first treated to provide it with an oxidized surface which is capable of adhering to a polymeric material. One such oxidizing process is termed Treatment A and is marketed by Circuit Foils Co., Bordentown, New Jersey. It is desirable that both sides of the copper sheet be oxidized for a multi-layer laminate. Once the copper surface is so treated, it is cleaned with a volatile solvent such as a low molecular weight alcohol, ketone, polychlorinated aliphatic, ester, or the like. Subsequently, a partially imidized polymer or a polyamide-imide precursor is coated to a uniform thickness on the treated copper sheet by either doctor blading or roller coating. Specific examples of commercially available polymers suitable for use are PI 1200 sold by E. I. du Pont de Nemours and Co. and RS 5521 available from the Monsanto Chemical Co.

After coating, the coated copper sheet is cured up to a maximum temperature of 200 degrees C, from 10 to 30 minutes to achieve a residual volatile level of between 3-12% in the polyimide. The partially cured polyimide coated, copper foil is then stacked upon a similarly treated polyimide glass cloth with as many additional layers being used as desired. The stack is then laminated at a pressure of 200-3000 PSI and a...