Browse Prior Art Database

Interconnection Devices

IP.com Disclosure Number: IPCOM000094201D
Original Publication Date: 1966-Jul-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 3 page(s) / 75K

Publishing Venue

IBM

Related People

Smith, JF: AUTHOR

Abstract

The top drawing shows one form of electrical interconnection device for bridging terminal edges of evaporated memory plane substrates 8 and 9. Compressed air is sent through a top inlet to effect connection after air chamber 3 is lowered near the substrate ends. Bonded to the lower edges of the open bottom of chamber 3 is flexible plastic diaphragm 1 bearing a set of spaced, printed interconnection conductor lines 2. Diaphragm 1 is centrally superimposed over the two ends of the separate but adjoining terminal portions of substrates 8 and 9 and over aligned conductors 7 on them. Lines 2 on diaphragm 1 are long enough to establish bridging contact between related lines 7. This occurs when diaphragm 1 is distended by air pressure and forced into contact with conductors 7.

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Interconnection Devices

The top drawing shows one form of electrical interconnection device for bridging terminal edges of evaporated memory plane substrates 8 and 9. Compressed air is sent through a top inlet to effect connection after air chamber 3 is lowered near the substrate ends. Bonded to the lower edges of the open bottom of chamber 3 is flexible plastic diaphragm 1 bearing a set of spaced, printed interconnection conductor lines 2. Diaphragm 1 is centrally superimposed over the two ends of the separate but adjoining terminal portions of substrates 8 and 9 and over aligned conductors 7 on them.

Lines 2 on diaphragm 1 are long enough to establish bridging contact between related lines 7. This occurs when diaphragm 1 is distended by air pressure and forced into contact with conductors 7. Chamber 3 over diaphragm 1 is fabricated of PLEXIGLAS* which affords visual alignment of lines 2 before the application of air pressure. Diaphragm 1 also carries a strip of conductive material 5 separated from lines 2 by a sheet of insulation 6. Bridging strip 5 is used for establishing a connection between two ground plane coatings 4 on the surfaces of substrates 8 and 9. The interconnection device can be employed in memory plane testing jigs. In the latter the line 2 widths and spacings can be changed and different diaphragms 1 substituted to cooperate with the changed arrangement.

The center drawing shows an alternative form of the interconnection device of the top drawing but without the need for compressed air. The device comprises transparent PLEXIGLAS clamping block 10. This permits visual alignment of underlying transmission line conductors 7. These are connected by bridging member 11. The latter carries a set of parallel projecting lines 12. These are pressed into contact with lines 7 of abutting substrates 8 and 9 of an evaporated memory plane. Block 10 is mounted to be pushed downward on the abutting ends of substrates 8 and 9 or memory plane frames when they are placed in a test jig.

Block 10 is formed with three underlying grooves 13 machined in...