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Mosaic Cathode Structure for Large Sputtering Systems

IP.com Disclosure Number: IPCOM000094222D
Original Publication Date: 1966-Jul-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Standley, CL: AUTHOR [+2]

Abstract

The fabrication of large targets for RF sputtering systems is increasingly more difficult as the size of the sputtering target or cathode increases. Targets of certain materials, such as specialized glasses, have been impossible to fabricate in large enough sizes for practical production equipment uses. Mosaic target or cathode structure 1 overcomes these fabrication problems. Structure 1 is composed of a pattern of grounded metal bars 2 with small target areas of material 3 to be sputtered between them. The function of bars 2 in the joints between areas 3 is to locally distort the electrical field and prevent sputtering and arcing in these areas. Bars 3 are connected to outer grounded shield 4. The latter prevents sputtering from the back of the cathode structure.

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Mosaic Cathode Structure for Large Sputtering Systems

The fabrication of large targets for RF sputtering systems is increasingly more difficult as the size of the sputtering target or cathode increases. Targets of certain materials, such as specialized glasses, have been impossible to fabricate in large enough sizes for practical production equipment uses. Mosaic target or cathode structure 1 overcomes these fabrication problems. Structure 1 is composed of a pattern of grounded metal bars 2 with small target areas of material 3 to be sputtered between them. The function of bars 2 in the joints between areas 3 is to locally distort the electrical field and prevent sputtering and arcing in these areas. Bars 3 are connected to outer grounded shield 4. The latter prevents sputtering from the back of the cathode structure. Appropriate cathode 1 to anode 5 spacing and chamber pressure cancels out the effect of the nonuniform glow caused by the presence of bars 2.

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