Browse Prior Art Database

Ball Dispenser

IP.com Disclosure Number: IPCOM000094247D
Original Publication Date: 1966-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Phinney, R: AUTHOR

Abstract

This dispenser provides a measured number of copper balls, preferably gold-plated, from a reservoir.

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Ball Dispenser

This dispenser provides a measured number of copper balls, preferably gold-plated, from a reservoir.

Copper balls, shown at A are used to interconnect semiconductor lands with conductive patterns and must be undamaged when placed upon the semiconductors. The dispenser, drawing B, includes a reservoir 10 of copper balls which feed through constriction 12 into an orifice 13 of known dimension within stopcock 14. Upon rotating stopcock 14, the copper balls contained within orifice 13 drop out through constriction 16 and flared-out portion 18 upon a semiconductor wafer, not shown, positioned beneath.

Constriction 12 restricts the pressure exerted upon the copper balls within orifice 13 by the copper balls in the reservoir. This prevents any significant friction from being exerted upon the balls when stopcock 14 is rotated and thus prevents their being damaged. Constriction 16 acts to slow the descent of the copper balls as they drop out of the orifice in stopcock 14. This prevents their impacting upon the semiconductor wafer with an excessive velocity. Portion 18 acts to disperse the copper balls when they drop through constriction 16.

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