Browse Prior Art Database

Solder Mask

IP.com Disclosure Number: IPCOM000094248D
Original Publication Date: 1966-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Schwenn, CW: AUTHOR

Abstract

This printed circuit board solder mask is not subject to warpage when passed over a solder wave or dipped into a solder bath.

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Solder Mask

This printed circuit board solder mask is not subject to warpage when passed over a solder wave or dipped into a solder bath.

As shown at A, printed circuit board 10 has copper circuit lands 12 which are to be tinned in a solder bath. To prevent a layer of solder from being formed over all of the circuit lines on board 10, solder mask 14 is placed over board 10 so that its openings 16 align with the areas of conductors 12 which are to be tinned. Mask 14 has a layer of silicon rubber 18 deposited over its entire surface as shown at B.

Rubber 18 performs several functions. One is to prevent the too-rapid transfer of heat from the solder bath to mask 14 during the soldering process. This prevents mask 14 from becoming overheated and warped. Additionally, rubber 18 provides a gasketing effect around each area being tinned and prevents the seepage of solder onto other portions of board 10.

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