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Production of Multiple Chip Capacitors by Use of a Prescored Substrate

IP.com Disclosure Number: IPCOM000094330D
Original Publication Date: 1966-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Delaney, RA: AUTHOR [+4]

Abstract

The use of a prescored substrate facilitates fabrication of a plurality of identical microminiature capacitors.

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Production of Multiple Chip Capacitors by Use of a Prescored Substrate

The use of a prescored substrate facilitates fabrication of a plurality of identical microminiature capacitors.

In A, ceramic substrate 1 is prescored into 15 rectangles 65 x 95 mils and approximately 8 mils thick. To the surface of each rectangle, successive layers of electrode 2, dielectric 3, and electrode 4 are applied using standard silk screening techniques as in B.

After coating with encapsulant material 5 and dip soldering at 6 as in C, substrate 1 is broken along the scored lines into a plurality of individual chip capacitors as in drawing D.

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