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Forming High Temperature Glass Films

IP.com Disclosure Number: IPCOM000094366D
Original Publication Date: 1966-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pliskin, WA: AUTHOR

Abstract

This method forms high-temperature glass films. Such are realized without subjecting the substrate to the usual heating to the high-softening point temperatures of such glasses.

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Forming High Temperature Glass Films

This method forms high-temperature glass films. Such are realized without subjecting the substrate to the usual heating to the high-softening point temperatures of such glasses.

Due to viscosity considerations, it is difficult to readily manufacture very high temperature glasses. In some processing techniques, it is desirable to form a very high-temperature glass film which does not penetrate a thin protecting SiO(2) film on a silicon substrate. However, high-temperature glass normally penetrates a thin SiO(2) film when heated to the softening temperature thus exerting a disrupting often destructive effect on the semiconductors.

The method consists of preparing a mixture of finely divided glass having an intermediate softening point temperature and finely divided SiO(2). The mixture is deposited by conventional sedimentation techniques and fired. The mixture, upon firing, tends to dissolve the SiO(2) particles in the glass thus forming a glass composition having a higher softening point. The resultant glass therefore remains relatively viscous when subsequently heated and is consequently precluded from significantly penetrating the thin SiO(2) film.

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