Browse Prior Art Database

Locating and Indexing Fixture for Semiconductor Wafer Dicing

IP.com Disclosure Number: IPCOM000094400D
Original Publication Date: 1966-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 79K

Publishing Venue

IBM

Related People

Musits, B: AUTHOR [+2]

Abstract

This clamping and indexing fixture as shown in drawings A and B is used to facilitate orthogonal dicing of a semiconductor wafer.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Locating and Indexing Fixture for Semiconductor Wafer Dicing

This clamping and indexing fixture as shown in drawings A and B is used to facilitate orthogonal dicing of a semiconductor wafer.

This fixture permits dicing of wafers while maintaining very close tolerances in kerf size and in kerf location. During the cutting operation, all clamping forces are internal. The fixture comprises pins 1 and 2 for locating wafer transfer block T on which is mounted a wafer. Proper location is provided by flat pad 5 and V- pad 6 resting on pins 1 and 2, respectively. Clamps 3 and 4 derive their clamping force through compression springs 7. Clamps 3 and 4 are manually released by turning knob 8 causing cam 9 to pivot followers 10 against the blunt nose of such clamps. Clamps 3 and 4 are rotate-d by the action of pin 11 in slanted slot 12 thus insuring a better seating against pins 1 and 2. This results in better seating of block T.

Torque motor 13 is coupled to the indexing shaft assembly and holds it in position. Reversal of motor 13 brings stop 14 against lug 16 thus repositioning the wafer 90 degrees from its original position for a second dicing cut.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]