Browse Prior Art Database

Article Handling Apparatus

IP.com Disclosure Number: IPCOM000094415D
Original Publication Date: 1966-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Metreaud, CG: AUTHOR

Abstract

This article handling apparatus is especially adapted for handling disk-shaped articles such as semiconductor wafers. In A, wafer W is supported by a cushion of air passing through perforated plate P which forms one wall of plenum chamber 1. Article handling apparatus 2 comprises a vertically movable shaft 3 slidably supported by two flanges 4 and 5 of frame 6. Shaft 3 is movable by preferably pneumatic devices contained in actuator T. Shaft 3 is hollow and coupled by conduit 7 to a vacuum source not shown.

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Article Handling Apparatus

This article handling apparatus is especially adapted for handling disk- shaped articles such as semiconductor wafers. In A, wafer W is supported by a cushion of air passing through perforated plate P which forms one wall of plenum chamber 1. Article handling apparatus 2 comprises a vertically movable shaft 3 slidably supported by two flanges 4 and 5 of frame 6. Shaft 3 is movable by preferably pneumatic devices contained in actuator T. Shaft 3 is hollow and coupled by conduit 7 to a vacuum source not shown.

Upon lowering of shaft 3 to the position shown in B, weight 8 having annular extension 9 is also lowered to permit such extension to contact end portions 11 and 12, respectively, of arms 13 and 14. Preferably, at least three resilient mounted arms are provided, two of which are shown. Shaft 3 continues its downward motion and contact is made by its end with the top of wafer W.

In C, shaft 3 is moved upwardly thus carrying wafer W into position between clamping members 15 and 16 of arms 13 and 14, respectively. Removal of weight 8 by flange 17 of shaft 3, simultaneous with the positioning of wafer W, causes arms 13 and 14 to move inwardly and permit members 15 and 16 to hold the outer edge of wafer W. In this position, wafer W is removed from the wafer handling system and is available for any further operation.

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