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Contact Plating Process for Printed Circuits

IP.com Disclosure Number: IPCOM000094421D
Original Publication Date: 1965-Jan-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Lenoble, JP: AUTHOR [+4]

Abstract

Printed circuits are manufactured by an additive type process by contact plating through a reusable mask having the circuit configuration.

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Contact Plating Process for Printed Circuits

Printed circuits are manufactured by an additive type process by contact plating through a reusable mask having the circuit configuration.

Tank 135 contains an electrolyte such as an acid copper sulfate solution. Spaced about the tank are four rollers 136... 139 about which endless belt 140 passes. Belt 140 coacts with hollow cylinder 141 between the rollers 136 and 137 to hold the cylinder on its axis when the belt is advanced by motor 134 connected to roller 137. Flexible strip material 142, in the form of an insulating substrate metallized with evaporated copper, passes from feed roll 143 between the belt and cylinder to take-up roll 144. Roller 145 connected to the negative of a DC power supply contacts the metallized surface of strip 142. Copper anode 146 is immersed in the electrolyte in the center of cylinder 141.

Cylinder 141 has a porous cylindrical shell 150 about which cylindrical insulating mask 151 having openings in the desired circuit pattern is secured. Thus, electrolyte moves through cylinder 150 and the openings in mask 151 and plates on the metallized surface of strip 142. The plated strip on take-up roll 144 is slightly etched to remove the unwanted evaporated copper.

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