Browse Prior Art Database

Installing Changes on a Multilayer Board

IP.com Disclosure Number: IPCOM000094485D
Original Publication Date: 1965-Feb-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Byrnes, HP: AUTHOR [+4]

Abstract

This is an apparatus for providing change capability to a module-multilayer printed circuit.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 74% of the total text.

Page 1 of 2

Installing Changes on a Multilayer Board

This is an apparatus for providing change capability to a module-multilayer printed circuit.

The circuit package includes a plurality of modules 10 whose pins 12 mate with plated through-holes 14 in multilayer printed circuit board 16. Each module 10 contains discrete semiconductor circuitry with the interconnections between the modules being provided within circuit board 16. Subsequent to the production of such a circuit package, it is often necessary to change certain of the modules and to modify the interconnecting circuitry within circuit board 16. To provide this capability, an additional multilayer circuit board 18 is supplied. Wherever a change is desired, an insulated conductive tube 20 extends from multilayer circuit board 18 and is adapted, when circuit boards 16 and 18 are pressed against one another, to fit within a plated through-hole 14 and to effectively insulate a module pin 12 from the through-hole. The electrical connection is then made from pin 12 through tube 20 and into circuit board 18 where the interconnecting circuitry can connect to another such tube.

An expanded sectional view of this packaging technique is shown at the right. Pin 22 of module 10 is in its normal configuration where it connects to conductive plated through hole 24. Pin 26, however, no longer connects to conductive plated through hole 28 due to the insulation layer 30 around the exterior of conductive tube 32.

Layer 30 completely d...