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Laser Heat Sink

IP.com Disclosure Number: IPCOM000094506D
Original Publication Date: 1965-Feb-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Johnson, CM: AUTHOR

Abstract

This is a heat sink for a gallium arsenide laser diode 1 which is characterized by high heat transfer rates. The sink comprises a molybdenum base 2 having a silver inlay 3. Diode 1 is firmly attached to inlay 3 by, for example, soldering.

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Laser Heat Sink

This is a heat sink for a gallium arsenide laser diode 1 which is characterized by high heat transfer rates. The sink comprises a molybdenum base 2 having a silver inlay 3. Diode 1 is firmly attached to inlay 3 by, for example, soldering.

The arrangement capitalizes on the high thermal conductivity of silver while minimizing the effects of the differing coefficients of thermal expansion exhibited by silver and gallium arsenide. Ordinarily, it would not be considered feasible to attach gallium arsenide directly to silver. This is because the heat generated by diode 1, which is in turn transferred to inlay 3, expands the members 1 and 3 different amounts destroying the bond between them. However, the heat sink shown obviates this problem by inlaying silver 3 in molybdenum base 2.

Base 2, which has a coefficient of thermal expansion approximating that of gallium arsenide, constrains inlay 3 in the plane of base 2 and permits it to expand in the lateral direction no more than base 2. Thus, the lateral expansion inlay 3 and diode 1 is made equal.

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