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Rigid Conformal Encapsulant for Circuit Modules

IP.com Disclosure Number: IPCOM000094547D
Original Publication Date: 1965-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Merrin, S: AUTHOR [+2]

Abstract

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by this package. A soft, flexible coating 2, such as a cured silicone rubber, covers all electrical components mounted on the substrate 1.

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Rigid Conformal Encapsulant for Circuit Modules

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by this package. A soft, flexible coating 2, such as a cured silicone rubber, covers all electrical components mounted on the substrate 1.

An aluminum phosphate cement outer layer 3 encloses the package. The layer 3 is formed by intimately mixing activated alumina with phosphoric acid and applying the resulting paste-like material over the layer 2. The alumina and phosphoric acid react at room temperature within twenty-four hours to produce the solid aluminum phosphate layer 3.

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