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Module Encapsulant

IP.com Disclosure Number: IPCOM000094548D
Original Publication Date: 1965-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Merrin, S: AUTHOR [+3]

Abstract

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by this package. A thin layer of polyimide varnish 2 is sprayed over the passive electrical components on the surface of substrate 1 and cured. The layer 2 is sufficiently thin as to not cover the active chip components on the substrate 1.

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Module Encapsulant

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by this package. A thin layer of polyimide varnish 2 is sprayed over the passive electrical components on the surface of substrate 1 and cured. The layer 2 is sufficiently thin as to not cover the active chip components on the substrate 1.

A layer 3 of uncemented alumina powder covers all components. The layer 3 may be applied over the components as a slurry and then the liquid evaporated to leave the uncemented layer. A shell 4 is molded over the layer 3. The preferred shell material is a polyimide varnish filled with alumina or silica powder.

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