Browse Prior Art Database

Heat Sink

IP.com Disclosure Number: IPCOM000094614D
Original Publication Date: 1965-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

The heat sink 1 for a cylindrical component, such as transistor 2, is formed from sheet metal stock such as beryllium copper. Flat portion 3 is in the plane of the strip before it is formed. Cup portions 4 and 5 are struck up out of the strip stock without waste before the device is cut to length at ends 6 and 7.

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Heat Sink

The heat sink 1 for a cylindrical component, such as transistor 2, is formed from sheet metal stock such as beryllium copper. Flat portion 3 is in the plane of the strip before it is formed. Cup portions 4 and 5 are struck up out of the strip stock without waste before the device is cut to length at ends 6 and 7.

Cup clamps 4 and 5 are formed arcuately and slightly smaller in diameter than the cylindrical body 8 of the component upon which the heat sink is pressed. Ends 6 and 7 are bent at right angles to form two parallel L-shaped channels 9 and 10.

These long channels act as radiators for heat conducted to them. They also act as aerodynamic guides or conduits, either alone or when aligned for air stream conduction with others of the same kind in rows or columns.

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