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Cathode Sputtering Regulation

IP.com Disclosure Number: IPCOM000094618D
Original Publication Date: 1965-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Standley, CL: AUTHOR

Abstract

A process is provided for evaluating the glow discharge in a cathode sputtering process. Such enables determination as to whether uniformity of the resultant cathodically sputtered film is available under the conditions of operation.

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Cathode Sputtering Regulation

A process is provided for evaluating the glow discharge in a cathode sputtering process. Such enables determination as to whether uniformity of the resultant cathodically sputtered film is available under the conditions of operation.

Target material 4, such as potassium chloride or another alkali halide of a thickness between 5 to 10 microns, is deposited upon the face of cathode assembly 2. Shield 8 surrounds cathode 2, which, in turn, is enclosed by cooling coil 9. In substantial parallel-spaced relation is anode assembly 14, with glass support 22 on its surface. Substrate 24 is mounted on support 22. In the cathode sputtering of a material, substrate 24 provides a collection site for the sputtered atoms. Both cathode 2 and anode 14 are enclosed in bell jar 34.

Bell jar 24 is evacuated to a pressure in the order of a torr or so by vacuum pump 42. An inert gas, for example, argon, helium or krypton, is injected to a pressure of about one-tenth of a torr through port 38.

A potential is impressed between cathode 2 and anode 4 of leads 6 and 26, causing the inert gas to ionize. The ionized particles bombard the alkali halide target and effectuate the removal of atoms from the surface thereof. The ions bombarding the cathode cause the formation of color centers in the halide layer. The intensity of the hue observed is proportional to the ion density. Thus, the variation in color intensity over the cathode surface provides a contour map...