Browse Prior Art Database

Package

IP.com Disclosure Number: IPCOM000094619D
Original Publication Date: 1965-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Salansky, AF: AUTHOR

Abstract

This is a method for producing a package adapted to hold electronic components. To produce a package to hold magnetic cores such as the one shown at A, a laminate of copper sheets 10 on epoxy base 12 is the starting point B. A negative image of the core pattern is printed on copper sheets 10 and is subsequently etched away to produce the pattern shown at C. Each of copper areas 14 represents an eventual core receptacle.

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Package

This is a method for producing a package adapted to hold electronic components. To produce a package to hold magnetic cores such as the one shown at A, a laminate of copper sheets 10 on epoxy base 12 is the starting point B. A negative image of the core pattern is printed on copper sheets 10 and is subsequently etched away to produce the pattern shown at C. Each of copper areas 14 represents an eventual core receptacle.

The next step is to fill all of the etched-out areas with a suitable epoxy 16 to provide a substantially flush surface on both sides of the laminate shown at D. After epoxy coating 16 has dried, the entire laminate is dipped in a further etching bath so that copper areas 14 are etched away, leaving orifices 18 to hold the magnetic cores as in E.

This method of producing a package is also adaptable to provide significantly more complex package patterns for holding irregularly shaped devices.

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