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Prevention of Copper Oxidation by Fluoride Coating

IP.com Disclosure Number: IPCOM000094774D
Original Publication Date: 1965-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Radovsky, DA: AUTHOR [+3]

Abstract

In the processing of copper, such as copper-clad boards, the atmospheric exposure of copper results in a surface layer of oxide which is detrimental to soldering, for example. The oxide conventionally is removed by special cleaning immediately prior to a soldering operation.

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Prevention of Copper Oxidation by Fluoride Coating

In the processing of copper, such as copper-clad boards, the atmospheric exposure of copper results in a surface layer of oxide which is detrimental to soldering, for example. The oxide conventionally is removed by special cleaning immediately prior to a soldering operation.

This process provides a fluoride surface treatment of copper to prevent oxidation. A conventionally cleaned copper surface is immersed in a 50/50 by volume mixture of sulphuric acid and hydrofluoric acid for 5 minutes at 40-50 degrees C. Accelerated oxidation conditions do not adversely affect the treated copper in respect to its solderability. The fluoride treatment can be achieved by electrolytic methods or the use of other fluorine compounds.

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