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Bonding Plastic Sheets for Printed Circuit Boards

IP.com Disclosure Number: IPCOM000094782D
Original Publication Date: 1965-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Manny, MP: AUTHOR [+2]

Abstract

This process bonds a top plastic sheet 11 to a bottom plastic sheet 13 by using a thin interlay 15 of the same plastic, for example, polyethylene. Sheets 11 and 13 are conventionally irradiated which results in a higher temperature for flow than nonirradiated polyethylene. Upon application of heat at 248 degrees F and a slight pressure, interlayer 15 flows and bonds sheets 11 and 13.

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Bonding Plastic Sheets for Printed Circuit Boards

This process bonds a top plastic sheet 11 to a bottom plastic sheet 13 by using a thin interlay 15 of the same plastic, for example, polyethylene. Sheets 11 and 13 are conventionally irradiated which results in a higher temperature for flow than nonirradiated polyethylene. Upon application of heat at 248 degrees F and a slight pressure, interlayer 15 flows and bonds sheets 11 and 13.

This low temperature prevents distortion of the top and bottom sheets and shifting of the copper patterns 17 and 19. The resulting assembly has plastic material 21 which is chemically homogeneous with constant electrical properties, such as the dielectric value, for impedance purposes. With some materials, such as polyisobutylene, the irradiated material is degraded and nows at a lower temperature and so serves as the thin adhesive interlayer.

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