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Forming Holes in Printed Circuit Substrates

IP.com Disclosure Number: IPCOM000094783D
Original Publication Date: 1965-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Manny, MP: AUTHOR [+4]

Abstract

This printed circuit device 11 is initially processed by conventional methods to provide dielectric substrate 13 clad with copper foil 15. By standard etching techniques, a pattern of holes 17 is formed in the foil. The dielectric is polytetrafluoroethylene or a similar plastic.

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Forming Holes in Printed Circuit Substrates

This printed circuit device 11 is initially processed by conventional methods to provide dielectric substrate 13 clad with copper foil 15. By standard etching techniques, a pattern of holes 17 is formed in the foil. The dielectric is polytetrafluoroethylene or a similar plastic.

The dielectric at the hole location is irradiated by high-speed electrons from generator 19 through registered mask 21 so that the dielectric is embrittled. The next step in the batch process is the removal of the embrittled dielectric by air blast device 23 to provide through-holes 25.

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