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Electric Discharge Welding

IP.com Disclosure Number: IPCOM000094813D
Original Publication Date: 1965-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Redfield, DH: AUTHOR

Abstract

In the fabrication of magnetic thin-film storage devices, reliability problems are encountered as a result of electrically joining one con conductive network to another when a polymeric material is intermediate the networks. The problems essentially result from trapped gases on breakdown of the polymeric material during welding. It is now found that the conductive networks are easily welded by electric discharge or ultrasonic techniques to form reliable electrical connections, which techniques do not give rise to the problems previously mentioned.

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Electric Discharge Welding

In the fabrication of magnetic thin-film storage devices, reliability problems are encountered as a result of electrically joining one con conductive network to another when a polymeric material is intermediate the networks. The problems essentially result from trapped gases on breakdown of the polymeric material during welding. It is now found that the conductive networks are easily welded by electric discharge or ultrasonic techniques to form reliable electrical connections, which techniques do not give rise to the problems previously mentioned.

The conductive networks that are to be joined consist of two copper layers 10 and 11. These are separated one from the other by polymeric material 12 which is bonded to layers 10 and 11 by adhesive 13. Each layer contains an etched hole 14, positioned in axial alignment with one another. Holes 14 include 35 to 50 percent of the surface area that is to be joined or bonded together.

During the welding operation, layers 10 and 11 are subjected to the simultaneous application of heat and pressure which gives rise to the formation of gaseous material. As layers 10 and 11 are forced together through the application of the heat and pressure, these gases escape through holes 14 and retainment of the gases in the structure is avoided.

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