Browse Prior Art Database

Thermal Control for Memory Core Arrays

IP.com Disclosure Number: IPCOM000094865D
Original Publication Date: 1965-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

Higher switching speeds for operation of certain ferrite memory core arrays require thermal control which is not obtained by high-velocity air flow. Memory array 11 has its cores 12 surrounded by a grease-like material 13 of high thermal conductivity. Plastic housing 15 supports the array and copper plate 17 which contacts the grease-like material so that an effective thermal conductive path is provided. The heat which is conducted by plate 17 is controlled by conventional cooling or heating devices, such as thermoelectric device 19. This is automatically controlled relative to ambient temperature.

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Thermal Control for Memory Core Arrays

Higher switching speeds for operation of certain ferrite memory core arrays require thermal control which is not obtained by high-velocity air flow. Memory array 11 has its cores 12 surrounded by a grease-like material 13 of high thermal conductivity. Plastic housing 15 supports the array and copper plate 17 which contacts the grease-like material so that an effective thermal conductive path is provided. The heat which is conducted by plate 17 is controlled by conventional cooling or heating devices, such as thermoelectric device 19. This is automatically controlled relative to ambient temperature.

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