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Improving Water Stability, Strength and Adhesion Characteristics of Glass Films

IP.com Disclosure Number: IPCOM000094982D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pliskisn, WA: AUTHOR [+2]

Abstract

This is an improved method for firing glass particles to form a thin, hole-free, uniform glass film for encapsulating semiconductor devices. The formed glass film has improved water stability characteristics.

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Improving Water Stability, Strength and Adhesion Characteristics of Glass Films

This is an improved method for firing glass particles to form a thin, hole-free, uniform glass film for encapsulating semiconductor devices. The formed glass film has improved water stability characteristics.

Certain borosilicate glass particles lack good water stability to form a thin, hole-free, uniform glass film. The resulting glass film is improved when carried out in an ambient containing moisture. The moisture is present either during the entire firing process or during part of the firing process.

In one example, firing the glass particles in a nitrogen ambient where the nitrogen is bubbled through water at room temperature results in the formation of a glass film having greater water stability and resistance to cracking. The moisture content of the ambient ranges from a vapor pressure of 20 to 40 millimeters of mercury. However, the range can be extended. Infrared investigation shows that the improved water stability is due to the leaching out of some of the boron from the glass surface.

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