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Browse Prior Art Database

Recording Head Gap

IP.com Disclosure Number: IPCOM000094983D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Wilcox, DL: AUTHOR [+2]

Abstract

Current technology for fabricating magnetic ferrite recording head gaps employs shim material. This, during the gap formation step, is positioned between two ferrite pole pieces to maintain their separation. That space is then glassed in a subsequent step, thus providing a permanent gap of a desired dimension. This method cathodically sputters platinum shims onto the face of one ferrite pole piece. Such results in greater control over gap dimension than that available with foils or sheets of metal shims.

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Recording Head Gap

Current technology for fabricating magnetic ferrite recording head gaps employs shim material. This, during the gap formation step, is positioned between two ferrite pole pieces to maintain their separation. That space is then glassed in a subsequent step, thus providing a permanent gap of a desired dimension. This method cathodically sputters platinum shims onto the face of one ferrite pole piece. Such results in greater control over gap dimension than that available with foils or sheets of metal shims.

The sputtering is performed within vacuum chamber 10, shown in A, which includes anode 2 and cathode 4. These are held in parallel spaced relation, one to the other, by supports 6 and 8, respectively. Target material T which is preferably platinum is bonded to the face of cathode 4. Ferrite pole piece 12 with mask 14 in place is positioned on the face of anode 2, Screen 28 mounted on shaft 30 is disposed between anode 2 and cathode 4. Screen 28 remains in that position during the initial stages of the sputtering to permit cleaning of the target surface. Once completed, screen 28 is rotated away from the faces of anode 2 and cathode 4. Pressure is reduced within chamber 10 by vacuum pump 16. This is connected to the inner chamber by way of conduit 18. Valve 20 in conduit 18 controls the degree of vacuum. The sputtering gas, preferably argon, is injected into the inner chamber through conduit 22. Regulation of the now rate of the sputtering gas i...