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High Density Printed Circuit Connector

IP.com Disclosure Number: IPCOM000094990D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Callaway, RW: AUTHOR [+4]

Abstract

A high-density printed circuit connector with matched impedance characteristics is used to mount high-density printed circuit cards onto an interconnection board. Component-carrying card 10 has external signal planes and a plurality of internal voltage and ground distribution planes. Board 11 is a composite board made up of several sections mounted on a common set of pins 12 in at least three rows B, C, and D. The board sections have internal planes for ground and voltage distribution and are connected selectively to the headed pins in row C. Inverted U-shaped contact springs 13 are soldered to the external planes on card 10 in opposing pairs and are used only for signals.

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High Density Printed Circuit Connector

A high-density printed circuit connector with matched impedance characteristics is used to mount high-density printed circuit cards onto an interconnection board. Component-carrying card 10 has external signal planes and a plurality of internal voltage and ground distribution planes. Board 11 is a composite board made up of several sections mounted on a common set of pins 12 in at least three rows B, C, and D. The board sections have internal planes for ground and voltage distribution and are connected selectively to the headed pins in row C. Inverted U-shaped contact springs 13 are soldered to the external planes on card 10 in opposing pairs and are used only for signals.

Voltage and ground distribution are made on reverse beam contacts 14 attached to the edge of card 10 in selective contact with the internal planes. The connector socket on the card includes insulating housing 15 into which the card is inserted and retained by struck-out lugs on retainers 16 at the ends of the housing. Upon plugging card 10 onto board 11, contacts 13 engage the double row of pins in rows B and D while contacts 14 extend through slots in the bottom of housing 15 and are in pressure engagement with the headed pins in row C.

The C row contacts 14 make connection to each internal plane in pairs. They are attached by extending the internal plane to the edge of card 10 and electroplating a copper tab on the edge in contact with the internal plane...