Browse Prior Art Database

Microminiature Module

IP.com Disclosure Number: IPCOM000095004D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Bennett, M: AUTHOR

Abstract

Microminiature module 10 has various microelectronic devices and circuitry mounted on the top and bottom sides or on the bottom surface only of ceramic substrate 11. Pins on plated through-holes, not shown, are used to electrically connect the top and bottom sides of substrate 11 when circuitry is mounted on both sides. Heat resistant plastic sheet 12 having a plurality of conductor pins 13 molded in it is electrically and physically attached to contacts 14 on substrate 11 by solder joints 15. The solder connections are made by the usual solder reflow techniques.

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Microminiature Module

Microminiature module 10 has various microelectronic devices and circuitry mounted on the top and bottom sides or on the bottom surface only of ceramic substrate 11. Pins on plated through-holes, not shown, are used to electrically connect the top and bottom sides of substrate 11 when circuitry is mounted on both sides. Heat resistant plastic sheet 12 having a plurality of conductor pins 13 molded in it is electrically and physically attached to contacts 14 on substrate 11 by solder joints 15. The solder connections are made by the usual solder reflow techniques.

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