Browse Prior Art Database

Microelectronic Device Standoffs

IP.com Disclosure Number: IPCOM000095005D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR

Abstract

A positive standoff is required for mounting chip microelectronic devices on the conductive pattern of a dielectric substrate. Microelectronic chip device 1 is attached to conductive pattern 2 on dielectric substrate 3 by solder 4 and lead contacts 5. The spacing between device 1 and substrate 3 is maintained by standoff 6.

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Microelectronic Device Standoffs

A positive standoff is required for mounting chip microelectronic devices on the conductive pattern of a dielectric substrate. Microelectronic chip device 1 is attached to conductive pattern 2 on dielectric substrate 3 by solder 4 and lead contacts 5. The spacing between device 1 and substrate 3 is maintained by standoff 6.

A lead standoff pattern and lead contacts for device 1 are coevaporated onto it. A solder is applied to pattern 2 on substrate 3. A solder flux is applied to the solder areas. Device 1 is positioned onto the solder coated pattern.

The assembly is heated in an oven to the melting temperature of the solder and then cooled to room temperature to cause the joining of the device 1 contacts to the substrate 3 conductors. The lead contacts and standoffs which have a higher melting point than the solder remain essentially solid at the melting temperature of the solder. The standoff pattern is such that it does not contact the solder. A wide variety of lead standoff patterns is possible.

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