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Laser Hole making in Printed Circuit Boards

IP.com Disclosure Number: IPCOM000095038D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Kremen, SH: AUTHOR

Abstract

In making the small holes in printed circuit boards 11 with a beam from laser 13, top copper mask 15 and bottom copper mask 17, both having openings 19, are used as a heat sink. Such use prevents blistering of copper foils 21 and 23. Masks 15 and 17 give a better shape to the laser beam. The heat sink effect also prevents delamination of the copper foils from the base or substrate 25. To eliminate taper and residue in the hole 27, firing of the laser is repeated as required. Substrate 25 is suitably colored throughout, as necessary to be nontransparent to the laser beam being used. For example, with a ruby laser, polypropylene is colored black throughout.

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Laser Hole making in Printed Circuit Boards

In making the small holes in printed circuit boards 11 with a beam from laser 13, top copper mask 15 and bottom copper mask 17, both having openings 19, are used as a heat sink. Such use prevents blistering of copper foils 21 and 23. Masks 15 and 17 give a better shape to the laser beam. The heat sink effect also prevents delamination of the copper foils from the base or substrate 25. To eliminate taper and residue in the hole 27, firing of the laser is repeated as required. Substrate 25 is suitably colored throughout, as necessary to be nontransparent to the laser beam being used. For example, with a ruby laser, polypropylene is colored black throughout.

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