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Socket and Ball Solder Technique

IP.com Disclosure Number: IPCOM000095049D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Hopkins, LG: AUTHOR [+2]

Abstract

Conventional microminiature soldering of two or more wires involves the use of a pretinned terminal board onto which the wires are soldered. This is a method of soldering with a socket and solder ball without the use of a terminal board. A small socket 1 is made in a nonconductive material 2 such as plastic. Channels 3 can also be placed in the nonmagnetic material to facilitate placement of wires 4. Any number of wires 4 can then be placed in socket 1 and a solder ball 5 rammed in place on top of 4. The solder balls are then fused by heat. This can be done either with a soldering iron or in an oven.

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Socket and Ball Solder Technique

Conventional microminiature soldering of two or more wires involves the use of a pretinned terminal board onto which the wires are soldered. This is a method of soldering with a socket and solder ball without the use of a terminal board. A small socket 1 is made in a nonconductive material 2 such as plastic. Channels 3 can also be placed in the nonmagnetic material to facilitate placement of wires
4. Any number of wires 4 can then be placed in socket 1 and a solder ball 5 rammed in place on top of 4. The solder balls are then fused by heat. This can be done either with a soldering iron or in an oven.

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