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Browse Prior Art Database

Gold Nickel Plated Copper Ball Contacts for Microelectronic Devices

IP.com Disclosure Number: IPCOM000095050D
Original Publication Date: 1965-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Herdzik, RJ: AUTHOR [+4]

Abstract

Active semiconductor chip device 1 is of the order of square mils in size. Device 1 is a glass hermetically sealed component having ball contacts 2. Contacts 2 are attached to device 1 through openings in glass layer 3.

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Gold Nickel Plated Copper Ball Contacts for Microelectronic Devices

Active semiconductor chip device 1 is of the order of square mils in size. Device 1 is a glass hermetically sealed component having ball contacts 2. Contacts 2 are attached to device 1 through openings in glass layer 3.

Contacts 2 are composed of a substantially spherical copper ball. There is at least a coating of nickel over the copper and a coating of gold over the nickel. Preferably, two alternate coating layers of gold and nickel are over the copper ball. The gold and nickel coatings are applied by conventional electroless plating techniques.

The use of the gold-nickel coated, copper contacts 2 minimizes the formation of undesirable intermetallics and shorting in the joint between device 1 and substrate to which the chip is attached. The nickel intermediate coating prevents attack of the copper ball by the gold plating bath and the resulting deterioration of the spherical shape of contact 2.

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