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Glaze Resistor Fabrication

IP.com Disclosure Number: IPCOM000095184D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Block, ML: AUTHOR [+2]

Abstract

Glaze resistors are formed on a ceramic dielectric. Such forming is by applying a resistor paste of solid constituents mixed with an inert liquid vehicle to the dielectric, firing the same at an elevated temperature to form the resistor element pattern, and cooling the element to room temperature. During operation, the resistance of such devices increases with increase in ambient temperature. The thermal coefficient of resistance TCR is much smaller for devices fabricated as described below. This stable quality is imparted by refiring the resistors at a temperature lower than the initial firing temperature.

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Glaze Resistor Fabrication

Glaze resistors are formed on a ceramic dielectric. Such forming is by applying a resistor paste of solid constituents mixed with an inert liquid vehicle to the dielectric, firing the same at an elevated temperature to form the resistor element pattern, and cooling the element to room temperature. During operation, the resistance of such devices increases with increase in ambient temperature. The thermal coefficient of resistance TCR is much smaller for devices fabricated as described below. This stable quality is imparted by refiring the resistors at a temperature lower than the initial firing temperature.

The resistor paste comprises, by weight, 75% of solids and 25% of an inert liquid vehicle composed of a resinous binder, a volatizable solvent and a surfactant. The solids typically include, by weight, 53 7% indium oxide, 1.3% antimony pentaoxide and 45% borosilicate glass. The paste is applied to the dielectric, fired in air at 950 degrees C. for twenty minutes, and slowly cooled to room temperature in a cycle of twenty-five minutes.

The average TCR after refiring is 25-30% of the average TCR before refiring and is accompanied by a 24-68% increase in resistance. When the resistor paste solids include, by weight, 58.6% indium oxide, 1.4% antimony pentaoxide and 40% barium aluminum borosilicate glass, and the paste applied to the ceramic is initially fired in a nitrogen atmosphere, the average TCR after refiring is approximately 70% o...