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Metalizing Non Conductive Substrates

IP.com Disclosure Number: IPCOM000095191D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Geist, T: AUTHOR [+3]

Abstract

Prior to the electroless deposition of metal on a non-conductive substrate, the substrate is activated by dipping it in a stannous chloride bath. This is followed by an aqueous rinse and then dipping the substrate in a palladious chloride bath followed by an aqueous rinse. The density, porosity and adherence of the subsequently electrolessly deposited metal depends greatly on the amount of palladium metal which is deposited from the palladious chloride bath.

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Metalizing Non Conductive Substrates

Prior to the electroless deposition of metal on a non-conductive substrate, the substrate is activated by dipping it in a stannous chloride bath. This is followed by an aqueous rinse and then dipping the substrate in a palladious chloride bath followed by an aqueous rinse. The density, porosity and adherence of the subsequently electrolessly deposited metal depends greatly on the amount of palladium metal which is deposited from the palladious chloride bath.

To electrolessly deposit cobalt, for example, which is dense, nonporous and adherent on a polyester substrate, the palladious chloride solution used to activate the stannous chloride treated polyester contains 1.0 g/L PdC1(2) in water, contains no mineral acid, and has a pH of about 2.5 at 25 degrees C. This palladious chloride solution provides high adsorbate densities. These, in turn, provide a large number of bonding sites for the subsequently deposited cobalt or other metal forming ions.

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