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Nonsolderable Conductive Elements

IP.com Disclosure Number: IPCOM000095192D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schiller, JM: AUTHOR [+2]

Abstract

Metal filled pastes using silicone resin binders are screen-, brush-or spray-applied to a suitable substrate. On pyrolysis at 350 degrees C. and higher in a stepwise cycle, the silicone is oxidized to finely dispersed silica. The pyrolyzed film forms a conductive, nonsolderable element which adheres tenaciously to the substrate.

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Nonsolderable Conductive Elements

Metal filled pastes using silicone resin binders are screen-, brush-or spray- applied to a suitable substrate. On pyrolysis at 350 degrees C. and higher in a stepwise cycle, the silicone is oxidized to finely dispersed silica. The pyrolyzed film forms a conductive, nonsolderable element which adheres tenaciously to the substrate.

The paste comprises, by weight, 60-75% of metal particles and 25-40% of an inert liquid vehicle. The latter is a mixture of 60-70% silicone binder, 30-35% volatizable solvent and 0-5% surfactant.

Similar benefits are realized in fabricating resistive elements using a silicone resin binder.

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