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Combination Glaze Resistor

IP.com Disclosure Number: IPCOM000095212D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Mones, AH: AUTHOR [+2]

Abstract

Glaze resistors are formed on a ceramic dielectric by applying a resistor paste of solid constituents mixed with an inert liquid vehicle to the dielectric, firing the same at an elevated temperature to form the resistor element pattern, and cooling the element to room temperature. During operation, the resistance of such devices can either increase or decrease with increase in ambient temperature depending upon the solid constituents used. The thermal coefficient of resistance TCR is much smaller for devices fabricated as described. This stable quality is imparted by separately depositing the resistor pastes of different solid constituents onto the dielectric in a parallel side-by-side combination and firing them either separately or together.

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Combination Glaze Resistor

Glaze resistors are formed on a ceramic dielectric by applying a resistor paste of solid constituents mixed with an inert liquid vehicle to the dielectric, firing the same at an elevated temperature to form the resistor element pattern, and cooling the element to room temperature. During operation, the resistance of such devices can either increase or decrease with increase in ambient temperature depending upon the solid constituents used. The thermal coefficient of resistance TCR is much smaller for devices fabricated as described. This stable quality is imparted by separately depositing the resistor pastes of different solid constituents onto the dielectric in a parallel side-by-side combination and firing them either separately or together.

In both cases, the resistor paste comprises, by weight, approximately 75% of solids and 25% of an inert liquid vehicle composed of a resinous binder, a volatizable solvent and a surfactant. The solids for the first paste include, by weight, approximately 55% In(2)O(3) and 45% borosilicate glass. Those for the second paste are a 40% mixture of PdO and silver in metals ratio of 0.9/1 Ag/Pd and 60% borosilicate glass. The In(2)O(3) is applied to the dielectric, fired in air at 950 degrees C. for about 15 minutes and cooled to room temperature. The PdO paste is applied, fired in air at about 750 degrees C. for about 20 minutes and cooled to room temperature.

As shown in the upper drawing, the TCR for...