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Printed Delay Line

IP.com Disclosure Number: IPCOM000095215D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Altmann, EK: AUTHOR [+2]

Abstract

The delay line equalizes propagation times. The delay includes spiral line 11 of.010'' width with.0075'' between turns. The line is produced by screen printing a high-conductivity silver paste on the bottom of a 0. 040'' thick, 0. 455'' square titanium dioxide substrate 12. Ground plate 13 is printed on the top side of substrate 12. The assembly is fired at 750 degrees C. for 50 minutes, including rise and fall times in the oven. Glass crossover 14, such as Corning X167JQ glass, is screened from the center of spiral 11 to one outside edge of 11 and fired at 920 degrees C. for 30 minutes, not including rise and fall times. Then a silver paste crossover 16 is screened on crossover 14 to electrically connect the center of spiral 1 1 with one of twelve pinholes 15 and fired at 750 degrees C.

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Printed Delay Line

The delay line equalizes propagation times. The delay includes spiral line 11 of.010'' width with.0075'' between turns. The line is produced by screen printing a high-conductivity silver paste on the bottom of a 0. 040'' thick, 0. 455'' square titanium dioxide substrate 12. Ground plate 13 is printed on the top side of substrate 12. The assembly is fired at 750 degrees C. for 50 minutes, including rise and fall times in the oven. Glass crossover 14, such as Corning X167JQ glass, is screened from the center of spiral 11 to one outside edge of 11 and fired at 920 degrees C. for 30 minutes, not including rise and fall times. Then a silver paste crossover 16 is screened on crossover 14 to electrically connect the center of spiral 1 1 with one of twelve pinholes 15 and fired at 750 degrees C. for 50 minutes, including rise and fall time. Conductors 11, 13 and 16 on substrate 12 are electrically copperplated to reduce the DC resistance of the line. AMZIRC* or soft copper pins 17 are inserted through pinholes 15. *Trademark of American Metals Climax

Another ground plate 18 whose outer dimensions are the same as those of spiral 11 and consisting of fired silver paste and the appropriate copper plating deposit is printed on the bottom of a second, smaller titanium dioxide substrate 19, 0. 040'' thick and 0. 325'' square. The top of substrate 19 is glued to the bottom of substrate 12 using a high dielectric adhesive 20 such as a mixture of, by weight, 77...