Browse Prior Art Database

Soldering Fixture

IP.com Disclosure Number: IPCOM000095243D
Original Publication Date: 1965-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Schwenn, CW: AUTHOR

Abstract

This soldering fixture makes use of solid solder spheres. Each sphere is located with respect to a joint to be soldered. The joint is soldered without excessively heating the work piece.

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Soldering Fixture

This soldering fixture makes use of solid solder spheres. Each sphere is located with respect to a joint to be soldered. The joint is soldered without excessively heating the work piece.

The work piece to be soldered includes plastic sheet 10 to which copper conductor 12 is laminated. At one extremity of sheet 10 is copper connector 14. This bears a pair of crimps 16 and 18 that pierce sheet 10 to make contact with conductor 12.

To assure a long lasting connection, it is necessary to solder crimps 16 and 18 to conductor 12. This, however, must be done quickly and at a relatively low heat. This is because the application of an excessive heat to the laminate acts to cause conductor 12 to separate from sheet 10.

When terminal 14 is inserted into the soldering fixture, it rests directly on heated heat sink 20. This not only preheats the joint to be soldered, thus preventing thermal shock, but also confines the heat produced during the subsequent soldering action. Mask 22 lies above connector 14 and has a hole 24 which directly aligns with crimp 16. Solder ball 26 is dropped in place through tube 28.

After solder ball 26 is in place, soldering iron 30 drops down to contact and melt it to provide the solder joint between crimp 16 and conductor 12. The tip of iron 30 is of the nonwetting variety, e.g., molybdenum, to prevent the adherence of solder and resulting irregularities in the solder joint. When iron 30 is in place, the heat it produces is direc...