Browse Prior Art Database

Gold Plating Solution

IP.com Disclosure Number: IPCOM000095263D
Original Publication Date: 1965-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Walton, RF: AUTHOR

Abstract

This ductile and dense gold electroplate finds application as a coating for electrical contact devices.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Gold Plating Solution

This ductile and dense gold electroplate finds application as a coating for electrical contact devices.

The electroplate is produced from an alkaline phosphate-potassium gold cyanide solution and is formed on a metallic or an electrically conductive nonmetallic substrate. The electrolyte contains: potassium gold cyanide - KAu(CN)(2) 12.3 grams/liter or as metallic gold 8.24 grams/liter phosphate K(2)HPO(4) 360 grams/liter.

The specific gravity of the electrolyte is maintained between 23 degrees to 27 degrees Be and adjusted to this level with anhydrous diabasic potassium phosphate. The pH is maintained in the range between 10 and 11 and adjusted to that level with potassium hydroxide or monobasic potassium phosphate. The electrodeposition reaction is conducted at a temperature in the range between 120 degrees to 165 degrees F in the presence of platinum-plated or clad titanium anode and a cathode current density in the range between 0.70 to 2.5 amperes/ft./2/ is used.

1