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Electrodeposition of Gold

IP.com Disclosure Number: IPCOM000095342D
Original Publication Date: 1965-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Phillips, SL: AUTHOR

Abstract

Bright uniform gold deposits are readily obtained from the following solution and under the following conditions: Gold chloride (HAuCl(4). 3H(2)O) 3 grams/liter Thiolactic Acid (HSCH(2)CH(CH(3))COOH) 3 ml/liter Ammonium Hydroxide (NH(4)OH) 30 ml/liter Ammonium Chloride (NH(4)Cl) 5 grams/liter Final pH 9-10 Current density 1 ma./sq.in. Time 5 min. Anodes Stainless steel Temperature 75 Degrees F. These results are attributed to the use of thiolactic acid as a bath additive. Other polydentate ligands containing at least one mercaptan group can be substituted for thiolactic acid. These acids include cystein, cystine, thioglycolic acid, 3-mercaptopropionic acid thiomalic acid, 2-mercaptoethylamine, 1-thioglycerol and 1 2-dimercaptopropanol.

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Electrodeposition of Gold

Bright uniform gold deposits are readily obtained from the following solution and under the following conditions: Gold chloride (HAuCl(4). 3H(2)O) 3 grams/liter Thiolactic Acid (HSCH(2)CH(CH(3))COOH) 3 ml/liter Ammonium Hydroxide (NH(4)OH) 30 ml/liter Ammonium Chloride (NH(4)Cl) 5 grams/liter Final pH 9-10 Current density 1 ma./sq.in. Time 5 min. Anodes Stainless steel Temperature 75 Degrees F. These results are attributed to the use of thiolactic acid as a bath additive. Other polydentate ligands containing at least one mercaptan group can be substituted for thiolactic acid. These acids include cystein, cystine, thioglycolic acid, 3-mercaptopropionic acid thiomalic acid, 2- mercaptoethylamine, 1-thioglycerol and 1 2-dimercaptopropanol.

This gold electroplating bath and similar baths utilizing the above additives are useful for preparing thin gold protective coatings on material such as plated cobalt. Such is effected without formation of blisters in the plated cobalt.

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