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Mount for Light Emitting Diode

IP.com Disclosure Number: IPCOM000095393D
Original Publication Date: 1965-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Sunners, B: AUTHOR

Abstract

The mount for a light emitting diode has structure which rapidly and efficiently dissipates heat. The mount structure also maintains an effective seal between the lens and supporting base by relieving stresses caused by differential thermal expansion of elements.

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Mount for Light Emitting Diode

The mount for a light emitting diode has structure which rapidly and efficiently dissipates heat. The mount structure also maintains an effective seal between the lens and supporting base by relieving stresses caused by differential thermal expansion of elements.

Base 10 has a parabolic cavity 12 with GaAs light emitting diode 14 mounted in it. Base 10 is of copper and operates as a heat sink. Cavity 12 has an electroplated nickel or chromium coating 16 to provide high reflectivity and prevent contamination of diode 14 by copper from base 10. Glass bead housekeeper seal 19 is disposed on the relatively thin projecting edge 18 of base
10. This is adhered in sealing relation to ring 20. The latter is made of an alloy containing 29% Ni, 17% Co and 54% Fe. Seal 19 electrically insulates ring 20 from base 10.

Thermal stresses are relieved by the ductile nature of projecting edge 18. Metal ring 22, serving as a mount for lens 24, is soldered or welded to ring 20 by solder or weld 26. Electrical lead 28 is connected to ring 20 and diode 14. Base 10 and ring 20 form the two external electrical terminals for diode 14.

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