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Metallizing A Polyester Substrate

IP.com Disclosure Number: IPCOM000095404D
Original Publication Date: 1964-Jan-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fatzer, GD: AUTHOR [+4]

Abstract

Prior to the electroless deposition of a metal on a non-conductive substrate, palladium, a catalytic noble metal of the platinum family, is deposited on the substrate. The adhesion of the electroless deposit depends greatly on the amount of palladium which is deposited.

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Metallizing A Polyester Substrate

Prior to the electroless deposition of a metal on a non-conductive substrate, palladium, a catalytic noble metal of the platinum family, is deposited on the substrate. The adhesion of the electroless deposit depends greatly on the amount of palladium which is deposited.

To electrolessly deposit nickel on a polyester substrate with high adhesion, the polyester substrate is treated in a palladium chloride solution in which the pH is maintained between 0.7 to 1.2. Within this pH range, high absorbate densities are obtained for the palladium which, in turn, provides a large number of bonding sites for the nickel ions.

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