Browse Prior Art Database

Submerged Plating Contact For A Moving Web

IP.com Disclosure Number: IPCOM000095449D
Original Publication Date: 1964-Jan-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 3 page(s) / 36K

Publishing Venue

IBM

Related People

Snyder, KA: AUTHOR

Abstract

The cathodic contact of the continuous web electroplating device is submerged in the electroplating solution. The submerged location of the contact reduces the film path between the electroplating solution and the cathodic contact over the location of the contact outside of the electroplating solution. The shorter film path allows the use of lower power supply voltages. Where the continuous film to be electroplated is a high resistance film composed of a plastic base having a thin metallic coating over it, the submerged contact allows the film to be surrounded by a liquid rather than air wherever it is conducting current. This liquid covering provides a much better path by which heat generated within the substrate can be removed, thus reducing heat build-up within the film.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 3

Submerged Plating Contact For A Moving Web

The cathodic contact of the continuous web electroplating device is submerged in the electroplating solution. The submerged location of the contact reduces the film path between the electroplating solution and the cathodic contact over the location of the contact outside of the electroplating solution. The shorter film path allows the use of lower power supply voltages. Where the continuous film to be electroplated is a high resistance film composed of a plastic base having a thin metallic coating over it, the submerged contact allows the film to be surrounded by a liquid rather than air wherever it is conducting current. This liquid covering provides a much better path by which heat generated within the substrate can be removed, thus reducing heat build-up within the film.

Fluid cathodic contact 1 is completely submerged in electroplating solution 2 supported in insulating container 3. The path of continuous web 4 having a conductive surface to be electroplated is over guide roller 5, into the electroplating bath between a first pair of anodes 6, through submerged cathodic contact 1, out of the plating bath between a second pair of anodes 7 and around guide roller 8. Submerged cathodic contact 1 preferably includes a liquid mercury body 9 in an electrical insulator container 10. The body of mercury 9 is covered by insulating barrier liquid 11. Current carrying plate 12 is located within the body of mercury 9. Current carrying plate 12 is connected to the negative side of current source 13, while the pairs of anodes 6 and 7 are connected to the positive side of current source 13. Insulated guide roller 14 guides the continuous web through the cathodic contact 1.

When contin...