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Browse Prior Art Database

Metallizing Composition having Improved Solderability

IP.com Disclosure Number: IPCOM000095498D
Original Publication Date: 1964-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Camuzat, MM: AUTHOR [+2]

Abstract

This metallizing composition may be readily screened on a substrate as a conductor and coated with a solder for fastening chip circuit elements to the conductor. Circuit element interconnections of this type are described in a paper entitled ``An Approach to Low Cost High Performance Microelectronics'' by E. M. Davis, R. M. Schwartz and W. E. Harding. This paper was presented at the Western Electronic Conference, Los Angeles, California, August 21, 1963.

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Metallizing Composition having Improved Solderability

This metallizing composition may be readily screened on a substrate as a conductor and coated with a solder for fastening chip circuit elements to the conductor. Circuit element interconnections of this type are described in a paper entitled ``An Approach to Low Cost High Performance Microelectronics'' by E. M. Davis, R. M. Schwartz and W. E. Harding. This paper was presented at the Western Electronic Conference, Los Angeles, California, August 21, 1963.

Platinum or platinum black of less than one micron particle size has improved solderability when heated in a reducing atmosphere, typically forming gas to a temperature range between 200 degrees to 400 degrees C for approximately one-half hour. The flow rate of the forming gas is of the order of 10 cubic feet per hour. Alternatively, the platinum or platinum black can be heated in an inert atmosphere, typically argon, for one-half hour at a temperature of approximately 375 degrees C. The argon atmosphere and the like have a flow rate of 10 cubic feet per hour. The treated platinum or platinum black powder is combined with 2- 15% of glass frit or the like and an inert organic vehicle for silk screening on a suitable ceramic substrate. The glass aids the adhesion of the platinum to the ceramic substrate.

The deposited platinum composition when fired at a temperature of the order of 800 degrees C for approximately 20 minutes has excellent adhesion to the substrat...