Browse Prior Art Database

Magnetic Sputtering

IP.com Disclosure Number: IPCOM000095651D
Original Publication Date: 1964-Apr-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Bertelsen, BI: AUTHOR [+3]

Abstract

Thin magnetic films are cathodically sputtered under conditions where the substrate potential is selectively regulated to enhance the magnetic characteristics of the resulting deposit.

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Magnetic Sputtering

Thin magnetic films are cathodically sputtered under conditions where the substrate potential is selectively regulated to enhance the magnetic characteristics of the resulting deposit.

The sputtering is performed in an apparatus which has a glass or metallic substrate 10 positioned between anode 11 and nickel-iron cathode 12 which are enclosed by housing 13. Gas tight seals 30 join housing 13 to support platform
14. Conductor leads 11, 16 and 17 are coupled to substrate 10, anode 11 and cathode 12, respectively. A cathode shield 18 is mounted about cathode 12 to confine the glow discharge to the lower surface of the cathode. Similarly, shutter 19 is positioned below the cathode 12. Vacuum pump 22 is coupled to the apparatus by way of valve 21 and conduit 20. Inert gas is injected into

When sputtering, inert gas is admitted through conduit 23 while pump 22 draws a vacuum within housing 13. While a large negative potential is applied between cathode 12 and anode 11, substrate 10 is biased slightly negative with respect to anode 11.

In this fashion, wall coercive force Hc, anisotropy field H(ko) and dispersion beta are lowered thus providing a useful thin magnetic film for magnetic storage applications.

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