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Removal of Soldered Components

IP.com Disclosure Number: IPCOM000095713D
Original Publication Date: 1964-May-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Rose, EN: AUTHOR

Abstract

Soldered electrical components are removed from printed circuit cards or the like without the use of heat. The solder is softened by amalgamation with mercury and the components are pried off the circuit card.

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Removal of Soldered Components

Soldered electrical components are removed from printed circuit cards or the like without the use of heat. The solder is softened by amalgamation with mercury and the components are pried off the circuit card.

All of the resinous, or the like, protective coating is removed from soldered connections 1 which electrically connect electrical components 2 to the printed conductors 3 on circuit card 4. Connections 1 are submerged in mercury bath 5 as shown in the upper drawing. The solder is exposed to the mercury at room temperature for about sixty minutes, in the case of a tin-lead solder, or until the mercury has formed an, amalgam with the solder.

The circuit card is removed from bath 5, turned over as shown in the lower drawing, and the components pried loose from the soft amalgam. The amalgam residue is removed from the circuit card by use of a hot oil bath or sand blasting.

Mercury dissolves all common solders as amalgams. The rate at which the different solders are dissolved by the mercury, however, varies. The rate of dissolving can be increased by raising the temperature of the mercury bath.

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