Browse Prior Art Database

Cleaning of Surfaces Using Collidion Film

IP.com Disclosure Number: IPCOM000095746D
Original Publication Date: 1964-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Aliotta, CF: AUTHOR

Abstract

The surface of a semiconductor wafer or other substrate can be protected from contamination either subsequent to a cleaning process or between successive steps of a manufacturing process by forming a protective plastic film over it. Collodion (2% or 4% nitro cellulose in amyl acetate) forms a suitable protective film which is easily peeled to expose the substrate surface.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Cleaning of Surfaces Using Collidion Film

The surface of a semiconductor wafer or other substrate can be protected from contamination either subsequent to a cleaning process or between successive steps of a manufacturing process by forming a protective plastic film over it. Collodion (2% or 4% nitro cellulose in amyl acetate) forms a suitable protective film which is easily peeled to expose the substrate surface.

The protective film is formed by wetting the substrate surface with a collodion, or other plastic, solution to form a liquid film which is allowed to dry. Drying times range from 10 to 60 minutes, but can be reduced by directing a gas stream over the substrate surface. The protective film is peeled by adhesive techniques to expose the clean substrate surface.

1